Apple is expected to release a new Apple Watch model in September 2024, but there is a report from the supply chain side that a design change is planned that will make the logic board of Apple Watch X thinner. It has become.
Apple Watch X logic board thinner?
According to MacRumors, Taiwan’s DigiTimes reports that Apple has released its 2023 fiscal year supplier list and that Nan Ya PCB, the second largest provider of IC boards, has re-entered the supply chain.
According to DigiTimes’ sources, the next-generation Apple Watch will use a new resin-coated copper (RCC) motherboard design.
Resin-coated copper (RCC) is a thin layer of copper foil coated with a resin such as epoxy, which allows logic boards to be thinner and provides additional internal space for other components, such as the Apple Watch’s sensors. You will be able to secure it.
It is rumored that the Apple Watch
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